Inventors of the patent-pending process for treating assembled printed circuit boards using electroless nickel plating to eliminate tin whiskers.
Whisker problems have been experienced by SMART Group members on PCB surface finishes and component terminations. Even when all of the existing
mitigating practices have been followed [these problems] can still occur....
Given the long history and current use of electroless nickel, both on circuit board bare fabs and components, along with the historic tin whisker testing on nickel coated components, it looks like the search for an effective, easily-reworkable, easily-implemented, cost-effective process for the elimination of tin whiskers is over.
Learn about our revolutionary new process that applies electroless nickel to electronic assemblies to eliminate (not just mitigate) the tin whisker problem. Whisker Inpenetrable Metal Cap Process for Electronic Assemblies (PDF)
Whisker-Inpenetrable Metal Cap Process for Electronic Assemblies (PDF) Landman, Davy, Fritz; Reliability Society 2010 Annual Technical Report
Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin Whisker...; Leidecker, Panashchenko, Brusse; CALCE 5th Internation Tin Whisker Symposium
Toyota's Sudden Acceleration Problem May Have Been Triggered By Tin Whiskers; Silke Carty, Sharon; The Huffington Post, www.huffingtonpost.com; January 24, 2012
Whisker-Inpenetrable Metal Cap Process for Electronic Assemblies; Landman, Davy, Fritz; Reliability Society 2010 Anual Technical Report
Read John Burke's full article at: http://www.pcbdesign007.com/pages/zone.cgi?a=71147
RealTime™ video of SMT Magazine guest editor Bob Neves' interview with LDF Coatings co-founder Dennis Fritz at the Electronics Midwest 2010 conference:http://realtimewith.com/pages/rtwvprofile.cgi?rtwvcatid=11&rtwvid=1555
NASA's Goddard Space Flight Center tin whisker page:
Osborn, Kris. "Army Works to Decrease Lead-Free Electronic Components." Army AL&T Online. Sept. 2010. http://www.army.mil/article/40712/army-works-to-decrease-lead-free-electronic-components/
Tin Whiskers—A Long Term RoHS Reliability Problem (PDF); Robert J. Landman, H&L Instruments; IEEE Reliability Society 2008 Annual Technology Report.
A comprehensive compilation of tin whisker articles, PowerPoint presentations, movies, and pictures:http://www.hlinstruments.com/RoHS_articles
Sitemap ©LDF Coatings 2013-2015 All rights reserved.